Cost-Benefit Analysis Of Nitrogen Reflow Soldering
Oxygen control : <500ppm reduces voids but increases cost by 25% ROI calculation : Justified for high-reliability PCBs (e.g., aerospace) Alternative : Hybrid N₂-air systems balance quality and cost
Product Introduction
Oxygen control: <500ppm reduces voids but increases cost by 25%
ROI calculation: Justified for high-reliability PCBs (e.g., aerospace)
Alternative: Hybrid N₂-air systems balance quality and cost
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