How To Prevent Tombstoning Defects in SMT Assembly
Causes : Uneven pad heating (ΔT >5°C between pads). Incorrect stencil design (asymmetrical solder volume). Excessive placement offset (>30% of pad width). Solutions : Pad Design : Increase thermal relief on larger pad. Keep pad size ratio ≤1:1.5 for paired components. Reflow...
Product Introduction
Causes:
Uneven pad heating (ΔT >5°C between pads).
Incorrect stencil design (asymmetrical solder volume).
Excessive placement offset (>30% of pad width).
Solutions:
Pad Design:
Increase thermal relief on larger pad.
Keep pad size ratio ≤1:1.5 for paired components.
Reflow Profile:
Preheat slope <1.5°C/sec to balance temperature.
Soak time 60-90 sec at 150-180°C.
Process Control:
Use 3D SPI to verify paste deposition symmetry.
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