Products

Eight-zone reflow oven with 400mm mesh belt plus 280mm rail dual conveyor, Siemens PLC touch-screen control and plus-minus 1-2C accuracy.

Eight-zone hot air reflow oven with 350mm stainless mesh belt, PID control within plus-minus 1-2C and touch-screen PC for lead-free SMT soldering.

Ten-zone lead-free reflow oven with mesh belt + rail conveyor, ±1-2°C PID control and only 8-10 kW running power for high-mix SMT production.

Compact vacuum suction loader that automatically picks stacked bare PCBs and feeds them to the solder paste printer, with PLC control, adjustable suction cups and a standard SMEMA interface.

Inline 3D SPI system with multi-directional structured light imaging, 0.28 s/FOV inspection speed and AI-based defect analysis for solder paste printing quality control.

Fully automatic solder paste screen printer delivering ±0.025 mm printing accuracy, dual-view CCD alignment and a cycle time under 8 seconds for SMT production lines.