HW-SPI660M Inline SPI Solder Paste Inspection Machine
Inline 3D SPI system with multi-directional structured light imaging, 0.28 s/FOV inspection speed and AI-based defect analysis for solder paste printing quality control.
Product Introduction
HW-SPI660M Inline 3D Solder Paste Inspection Machine
The HW-SPI660M is an inline 3D solder paste inspection (SPI) system installed immediately after the screen printer in SMT lines. Multi-directional structured light imaging, combined with multi-sensor fusion algorithms, minimizes shadow artifacts and restores the true shape of paste defects, raising detection accuracy while cutting false calls. Intelligent programming recognizes solder regions automatically - no color extraction and no GERBER programming are required - and with an inspection speed of 0.28 seconds per FOV the HW-SPI660M keeps pace with high-throughput production while feeding real-time SPC statistics to quality management.
Key Features
- Multi-directional structured light 3D imaging with multi-sensor fusion algorithms - minimized shadowing, true-to-life defect restoration, higher accuracy and fewer false alarms
- Intelligent, simple programming: solder paste regions are identified automatically, with no color extraction and no GERBER programming required
- Phase-to-height mapping with precision calibration: sinusoidal grating projection and multiple phase sampling enhance data reliability and measurement accuracy
- Dynamic adaptive reference plane algorithm with a low-distortion telecentric lens, effectively compensating FPC flexing and board warpage
- 180 FPS high-speed camera and 1080P high-resolution projection unit for fast, precise inspection
- RGBG four-channel, three-color illumination improves MARK point positioning; true-color board imaging plus deep-learning algorithms intelligently distinguish solder regions and avoid silkscreen interference
- Mixed-board production supported with automatic program adjustment
- Remote control, remote assistance, Gerber file import and custom model training built in
Specifications
| Model | HW-SPI660M |
| Application | Inline inspection after the solder paste printer |
| PCB Size | 50 × 50 mm ~ 510 × 460 mm |
| PCB Thickness | 0.5 ~ 6 mm |
| Component Height | Top side 25 mm, bottom side 50 mm |
| Process Edge | 3 mm |
| Communication | Standard SMEMA interface |
| Camera | 4 MP area-scan high-speed industrial camera |
| Optics / Light Source | PCB three-color integrating light source + single-direction structured light projection unit |
| Inspection Items | Solder height, excessive solder, insufficient solder, offset, tailing, bridging, paste shape, coplanarity and more |
| Motion Structure | High-precision lead screw + servo motor |
| Mixed-Board Production | Supported, with automatic program adjustment |
| Monitor | 23.8-inch FHD display |
| Algorithms | Deep neural network, image comparison, color comparison, contour recognition |
| Inspection Speed | 0.28 s/FOV |
| Data Output | Automatically generated statistical analysis and SPC reports |
| Operating System | Ubuntu 18.04 LTS 64-bit |
| Additional Functions | Remote control, remote assistance, Gerber file import, custom model training |
| Air Supply | 0.4 ~ 0.6 MPa |
| Power Supply | AC 220 V, rated power 570 W |
| Working Environment | 10 ~ 45 °C, 30 ~ 85% RH |
| Dimensions / Weight | L1114 × W1280 × H1596 mm, 765 kg |
About HWGC
"Let developers focus on R&D, let producers manufacture with ease" - this mission drives everything at HWGC (Huawei Guochuang). From its plant in Shijiazhuang, Hebei, China, the company develops and manufactures a full range of SMT equipment: pick and place machines, reflow ovens, solder paste printers, SPI and AOI inspection systems, PCB handling equipment, conveyors and wave soldering machines. Electronics manufacturers, laboratories and hardware start-ups in markets worldwide rely on HWGC for dependable machines and practical, long-term engineering support.
Key Advantages
- In-house R&D and manufacturing under one roof - stable quality, short lead times and genuine factory pricing
- A complete inline ecosystem, from printing and inspection to placement and soldering, all designed to work together
- Free lifetime software updates and remote diagnostics that reduce the total cost of ownership
- English-speaking export team with video commissioning support and commonly used spare parts kept in stock
- Flexible customization for board dimensions, line direction and factory layout
Warranty and After-Sales Service
HWGC backs the HW-SPI660M with a one-year warranty starting on the delivery date. Before dispatch, every unit is assembled, calibrated and run through full inspection cycles. If a covered defect appears during the warranty period, we repair or replace the affected parts at no charge (consumables and damage from misuse are not covered). Support continues long after the warranty ends: lifetime technical consultation, cost-price spare parts and free software updates remain available, and our engineers respond promptly by video call, phone or email whenever help is needed.
Contact Us
Foreign Trade Sales: Mr. Sun
Phone · WhatsApp · WeChat: +86 18210740377
Website: www.smthw.com
Factory Address: Building 21, Junding Science & Technology Park, Shiyin Village, Luquan District, Shijiazhuang, Hebei, China
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