Reducing Solder Paste Defects Via SPI Inspection
Key parameters : Height (±15μm), volume (≥80% coverage), area (no bridging) AI optimization : Machine learning reduces false alarms by 40% Case study : Foxconn's defect rate dropped from 500ppm to 50ppm
Product Introduction
Key parameters: Height (±15μm), volume (≥80% coverage), area (no bridging)
AI optimization: Machine learning reduces false alarms by 40%
Case study: Foxconn's defect rate dropped from 500ppm to 50ppm
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