Avoiding Common Mounter Defects

Article Outline:

Top Defects & Fixes:

Tombstoning: Adjust stencil aperture ratios (1:0.8 for 0402 resistors).

Solder Balling: Humidity-controlled paste storage (<30% RH).

Misalignment: Vision system calibration with NIST-traceable targets.

Toolkit: X-ray inspection for BGA void analysis (target <5% void area).

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