SMT Miniaturization
Rework stations repair misplaced or defective components. Hot air tools desolder parts without damaging PCBs. BGA reballing requires precise temperature control and alignment jigs. Challenges include pad oxidation and thermal stress on adjacent components. J-STD-001 defines acceptable rework...
Product Introduction
0201 and 01005 components demand ultra-precise placement (±25μm). Microvias (≤50μm) enable high-density interconnects (HDI). Wafer-level packaging (WLP) integrates SMT with semiconductor processes. Laser direct imaging (LDI) creates 15μm trace widths. Flip-chip technology replaces wire bonding in compact designs. Inspection relies on high-magnification 3D AOI. Handling requires anti-static vacuum tweezers and micro feeders.
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