Step Stencil Design Guidelines For HDI PCBs
Key Parameters : Step-up Areas (Fine-pitch components): Thickness: 0.13mm (vs. standard 0.1mm). Aperture reduction: 5% to prevent solder bridging. Step-down Areas (Connectors/BGA): Thickness: 0.08mm to avoid excessive paste. Transition Zone : 45° tapered edges to ensure smooth printing....
Product Introduction
Key Parameters:
Step-up Areas (Fine-pitch components):
Thickness: 0.13mm (vs. standard 0.1mm).
Aperture reduction: 5% to prevent solder bridging.
Step-down Areas (Connectors/BGA):
Thickness: 0.08mm to avoid excessive paste.
Transition Zone:
45° tapered edges to ensure smooth printing.
Validation Method:
Measure solder paste height with 3D SPI (target: 0.12-0.15mm for step-up).
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