Peak Temperature And Time Control For Lead-Free Reflow

Peak Temperature And Time Control For Lead-Free Reflow

For SAC305 Alloy : Peak Temp : 240-250°C (260°C max for heavy boards). Time Above Liquidus (TAL) : 60-90 sec. Ramp-up Rate : 1.0-2.0°C/sec to prevent thermal shock. Failure Risks : Too High : PCB delamination (>260°C). Too Low : Cold joints (TAL <30 sec).

Product Introduction

For SAC305 Alloy:

Peak Temp: 240-250°C (260°C max for heavy boards).

Time Above Liquidus (TAL): 60-90 sec.

Ramp-up Rate: 1.0-2.0°C/sec to prevent thermal shock.

Failure Risks:

Too High: PCB delamination (>260°C).

Too Low: Cold joints (TAL <30 sec).

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