Peak Temperature And Time Control For Lead-Free Reflow
For SAC305 Alloy : Peak Temp : 240-250°C (260°C max for heavy boards). Time Above Liquidus (TAL) : 60-90 sec. Ramp-up Rate : 1.0-2.0°C/sec to prevent thermal shock. Failure Risks : Too High : PCB delamination (>260°C). Too Low : Cold joints (TAL <30 sec).
Product Introduction
For SAC305 Alloy:
Peak Temp: 240-250°C (260°C max for heavy boards).
Time Above Liquidus (TAL): 60-90 sec.
Ramp-up Rate: 1.0-2.0°C/sec to prevent thermal shock.
Failure Risks:
Too High: PCB delamination (>260°C).
Too Low: Cold joints (TAL <30 sec).
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