HW-AIS63X SPI
The HW-AIS63X is an in-line SPI (solder paste inspection) system from China SMT machine manufacturer HWGC. It sits directly after the solder paste printer in an SMT production line and checks whether paste printing thickness, volume and position are qualified before boards reach reflow. A 4-megapixel area-scan high-speed industrial camera, a PCB tri-color integral light source with a single-direction structured projection unit and deep neural network algorithms reproduce real paste images at 0.28 s per FOV. It covers PCBs from 50x50 mm to 510x460 mm and 0.5-6 mm thick, exports SPC data, and uses a standard SMEMA interface.
Key Features
- High-precision imaging that restores true solder paste images, combined with AI denoising for objective, repeatable measurement
- Special light source scheme adapts to PCB pads of different colors and materials, improving imaging accuracy on difficult boards
- AI intelligent programming generates the whole-board image with one key and configures parameters automatically, reducing dependence on engineer experience
- Three-point correlation integrates SPI, pre-reflow AOI and post-reflow AOI data to analyze defects fast, locate root causes and raise line yield
- Deep neural network algorithm supported by image comparison, color comparison and contour recognition
- Inspection of paste height, excess, insufficient, offset, peak, bridging, solder shape and coplanarity
- 0.28 s per FOV inspection speed with 4-megapixel area-scan camera and structured projection unit
- Standard SMEMA interface, automatic SPC statistical analysis output, remote control and remote assistance
- Gerber file import, custom model training, mixed-board production with automatic program adjustment, and high-precision ball screw plus servo motion
Technical Specifications
| Equipment Type | In-line SPI solder paste optical inspection system |
| Series | HW-AIS63X Series |
| PCB Size | 50 x 50 mm to 510 x 460 mm |
| PCB Thickness | 0.5-6 mm |
| Component Height | 25 mm on the top side, 50 mm on the bottom side |
| Process Edge | 3 mm |
| Camera | 4-megapixel area-scan high-speed industrial camera |
| Light Source | PCB tri-color integral light source plus single-direction structured projection unit |
| Solder Paste Inspection Items | Height, excess, insufficient, offset, peak, bridging, solder shape and coplanarity |
| Mixed-board Testing | Mixed-board production supported with automatic program adjustment |
| Algorithm | Deep neural network algorithm, image comparison, color comparison and contour recognition |
| Inspection Speed | 0.28 s/FOV |
| Operating System | Ubuntu 18.04 LTS 64-bit |
| Software Functions | Remote control, remote assistance, Gerber file import and custom model training |
| Communication | Standard SMEMA interface |
| Data Output | Automatic SPC statistical analysis |
| Motion Structure | High-precision ball screw plus servo motor |
| Display | 23.8-inch FHD monitor |
| Dimensions and Weight | L1114 x W1280 x H1596 mm, 765 kg |
| Air Supply | 0.4-0.6 MPa |
| Power Supply and Power | AC 220 V, rated power 570 W |
| Working Environment | Temperature 10-45°C, humidity 30-85% RH |
SMT Industry News
Smart factory and Industry 4.0 integration is spreading across SMT production lines, with MES connectivity and real-time process data becoming standard expectations rather than upgrades. Solder paste inspection is one of the first places that data can be captured, because every print result is a measurable number that can be fed back to the printer before defects multiply. AI server boards and other high-end computing PCBs raise the stakes further: denser pads and finer stencils leave less tolerance for paste volume variation. The HW-AIS63X Series answers with AI programming, SPC output, SMEMA communication and three-point correlation across SPI and AOI, so paste data becomes part of a closed-loop quality system.
Applications
The HW-AIS63X fits immediately after the solder paste printer in any SMT production line, providing pre-reflow process control for PCB assembly. It suits consumer electronics, communications equipment, automotive electronics, LED modules, power supplies and industrial control boards, especially high-mix factories running several board types on one line. Typical users include EMS providers, OEM assembly plants and quality engineering teams using SPC data to tune printer parameters. As an in-line SPI machine for paste thickness, volume and offset inspection, it helps factories cut rework and scrap while documenting print quality, backed by a China SMT machine manufacturer.
Foreign Trade Sales: Mr. Sun
Phone · WhatsApp · WeChat: +86 18210740377
Email: zghwgc@gmail.com
Website: www.smthw.com
Factory Address: Building 21, Junding Science & Technology Park, Shiyin Village, Luquan District, Shijiazhuang, Hebei, China
