HW-J500 Mixer

The HW-J500 is a fully automatic solder paste mixer from China SMT machine manufacturer HWGC. It quickly warms refrigerated solder paste, removes entrained air and mixes the paste homogeneously without opening the jar, so the material is ready for the solder paste printer as soon as the cycle ends. Two 500 g jars can be mixed at once, or one jar can be balanced by the supplied 500 g counterweight jar. Microcomputer control, an OMRON time relay, a 1,350 rpm motor, a compact 400x400x500 mm frame and 45 kg weight make it an easy addition to any SMT production line.

Key Features

  • FY-series microcomputer control with a branded OMRON time relay that stops the cycle automatically at the set time
  • Dual-can fixture mixes two 500 g solder paste jars at once, cutting preparation time; a 500 g counterweight jar balances single-can runs
  • Sealed mixing: the jar stays closed during the cycle, so the paste is protected from oxidation and moisture absorption
  • Planetary revolution plus rotation mixing warms cold paste quickly, blends it evenly and provides a defoaming effect
  • Old and new solder paste can be mixed together to restore a more active, workable paste
  • Balanced fixture design reduces vibration for stable, quiet operation and repeatable results
  • Safety micro switch in the lower right of the cabinet stops the machine immediately when the top cover is opened
  • LED digital display with a timer range of 0.01 s to 99 h 99 s across hour, minute and second units
  • Standard tooling for 60-67 mm diameter jars fits common 500 g solder paste bottles; other sizes use custom fixtures

Technical Specifications

Product ModelHW-J500
FunctionRapid warming, defoaming and uniform mixing of refrigerated solder paste
Control SystemFY-series microcomputer control
Operation ControlBranded OMRON time relay; automatic stop when the set time is reached
Motor Speed1,350 rpm
Revolution Speed (primary)400 rpm
Rotation Speed (secondary)300 rpm
Working Capacity0-500 g x 2 cans
Accepted Paste Jar SizeJar diameter 60-67 mm standard (common 500 g solder paste bottles)
FixtureCustomized to customer requirements; single-can runs balanced by the supplied counterweight jar
Mixing TimeTypically 2 min or 1 min 30 s for solder paste; 5 min for silver paste; other chemical inks mixable with time adjusted to material characteristics
Timer Setting Range0.01 s to 99 h 99 s, with three timing units (H, M, S); minutes are used in normal operation
DisplayLED digital display
Rated Power60 W (constant speed)
Power SupplyAC 220 V ±10%, 50 Hz
Dimensions400 x 400 x 500 mm
Weight45 kg
Standard AccessoriesPower cord x 1, round drive belts x 2, 500 g counterweight jar x 1
Safety FunctionMicro switch stops the machine immediately when the top cover is opened
Mixing PrincipleMotor-driven revolution and rotation; paste is mixed without opening the container
Applications of the ProcessSolder paste, silver paste and chemical inks, with mixing time set to material characteristics

SMT Industry News

October 2026's NEPCON Asia exhibition showcased next-generation SMT placement systems, advanced packaging solutions and autonomous material handling, including the ASMPT SIPLACE V China debut, Essemtec all-in-one SMT and packaging solutions, and Hanwha Semitec chip mounters with AMR robots. As placement and material logistics get faster, solder paste preparation becomes a visible bottleneck and a source of variation before printing. A controlled mixer helps factories standardize that step: the jar stays sealed, the timer ends the cycle at a fixed point, and paste reaches the stencil at the right consistency. That repeatability supports smart factory projects that expect every workstation in an SMT production line to be predictable and documented.

Applications

The HW-J500 is used at the start of any SMT production line that prints solder paste: it warms paste taken from cold storage and delivers a ready-to-print, bubble-free material to the printer. Typical users are PCB assembly plants, EMS providers, LED and power supply manufacturers, automotive electronics suppliers, semiconductor packaging houses and R and D laboratories working with solder paste, silver paste or conductive adhesives. For small and high-mix shops, the two-jar capacity and customizable fixtures keep paste preparation quick and consistent.

Foreign Trade Sales: Mr. Sun
Phone · WhatsApp · WeChat: +86 18210740377
Email: zghwgc@gmail.com
Website: www.smthw.com
Factory Address: Building 21, Junding Science & Technology Park, Shiyin Village, Luquan District, Shijiazhuang, Hebei, China

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