Ersa Selective Win

Through-hole components are not disappearing, and neither is the soldering equipment that joins them. In November 2026, Kurtz Ersa's VERSAFLOW FIVE selective soldering system won a 2026 Global Technology Award - recognition for a machine that rethinks how high-end selective soldering handles flexibility, automation and energy use. Its feature set points to where through-hole and mixed-technology assembly is heading: automated nozzle changes, parallel board processing and precisely zoned preheating.

Industry Update

The VERSAFLOW FIVE is built for demanding industries - automotive, aerospace and industrial electronics - and its core innovation is the VERSAFLEX 2.0 solder module. It processes standard formats plus XL assemblies up to 685 mm long and 508 mm wide, with a maximum board weight of 12 kg. Two stoppers allow two boards of up to 320 mm each to be soldered simultaneously without prior synchronization, which the company says lifts output by a double-digit percentage. In synchronous mode both axes move in parallel at a fixed distance for consistent quality; in asynchronous mode they run independent programs, so two boards with different nozzle geometries or solder alloys can be processed at the same time - with integrated collision monitoring for safety.

Automation targets the hidden cost of high-mix production: setup and maintenance. An optional automatic nozzle changer swaps solder nozzles without operator intervention, adapting to the geometry each program requires, both during operation and during new-job setup. A matrix-style preheater divides the infrared emitters into six independently controlled segments, so each assembly is heated according to its own requirements - reducing thermal stress and improving energy efficiency. Automatic flux nozzle cleaning and a CAD expert mode round out the package. The award adds to a clear 2026 trend: soldering, like placement and inspection, is being automated around small batches, frequent changeovers and traceable process data.

What It Means for SMT Lines

• Selective soldering remains essential for connectors, shields and through-hole parts that reflow cannot reach; equipment choice directly affects mixed-technology yield.
• Automatic nozzle changing cuts setup time and human error in high-mix production, where programs change daily.
• Matrix preheating with independently controlled zones protects thick or thermally sensitive assemblies from warpage and cold joints.
• Parallel board processing can raise throughput without adding floor space - valuable where capacity is tight.
• Energy efficiency and reduced operator dependence are becoming purchasing criteria as labor and power costs rise.

Outlook

Expect selective soldering platforms to keep adding automation - nozzle management, profiling assistance, connected diagnostics - as factories face high-mix orders and fewer skilled operators. For lines that combine SMT and through-hole assembly, the winning configuration is a coordinated set of printing, placement, reflow, selective or wave soldering and inspection, planned together rather than assembled piecemeal. HWGC, a China SMT machine manufacturer, supplies four-head to twelve-head pick and place machines, reflow soldering ovens, solder paste printers, wave soldering systems, PCB loaders, conveyors and AOI/SPI inspection equipment for complete SMT and mixed-technology production lines.

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