BGA Voiding Standards And Reduction Techniques
IPC Standards : Class 1/2: ≤25% void area per joint. Class 3 (Medical/Aerospace): ≤15%. Reduction Methods : Paste Selection : Low-voiding pastes (e.g., Halogen-free). Reflow Profile : Nitrogen atmosphere (<500ppm O₂). Stencil Design : Smaller apertures (90% pad size).
Product Introduction
IPC Standards:
Class 1/2: ≤25% void area per joint.
Class 3 (Medical/Aerospace): ≤15%.
Reduction Methods:
Paste Selection: Low-voiding pastes (e.g., Halogen-free).
Reflow Profile: Nitrogen atmosphere (<500ppm O₂).
Stencil Design: Smaller apertures (90% pad size).
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