SMT Pick-and-Place Machines
Article Outline : Symptom-Based Solutions : Error Code E507 : Feeder misalignment – recalibrate with go/no-go gauge. Inconsistent Paste : Check solder viscosity (150–200 Pa·s). Z-Axis Drift : Replace linear encoder scales. Quick-Reference Table : Common issues, tools needed,...
Product Introduction
Solder paste composition directly impacts SMT reliability. Comprising tin, silver, and copper alloys (e.g., SAC305), its viscosity must suit stencil printing. Particle size (Type 3-5) affects deposition for fine-pitch components. Flux chemistry influences wettability and residue corrosivity. No-clean pastes reduce post-process cleaning, while water-soluble variants suit high-reliability applications. Storage requires refrigeration to prevent oxidation. Printability tests measure slump and tack force. Challenges include void formation under BGAs, addressed through vacuum reflow or paste formulation upgrades.
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