HW-R306 Reflow Oven

The HW-R306 is a three-zone desktop or vertical SMT reflow oven from a China SMT machine manufacturer. Using forced hot air, it melts the solder paste on PCB pads to form reliable solder joints between surface mount components and the board. Despite its compact size, the machine delivers serious thermal performance: temperature control precision of ±1°C, PCB lateral temperature deviation of ±2°C, K-type thermocouples that respond to temperature fluctuation within 2 seconds, and a warm-up time of under 15 minutes. Designed for CHIP components and ICs, it is a practical reflow soldering stage for small and medium PCB assembly operations building their own SMT production line.

Key Features

• Vacuum-sealed nickel-chromium heating elements with double magnesium-oxide insulation isolate the heating wire from air, preventing oxidation and extending heater life
• K-type thermocouples rated up to 1100°C use exposed probes that respond to temperature changes within 2 seconds, keeping the gap between the set value and actual air temperature within 1°C
• Turbo-charged hot-air micro-circulation with air guides and an accelerator prevents backflow, so air stays circulating inside the chamber with low heat loss and high thermal efficiency
• An aluminum wind wheel driven by a motor improves chamber heat circulation and thermal compensation for better uniformity while saving power
• Warm-up from room temperature to constant temperature takes about 8 minutes; one-key start lets production begin about 15 minutes after power-on for standard processes, with hourly power consumption of no more than 3 kWh
• Microcomputer intelligent instrument PID closed-loop control keeps the PCB surface lateral air temperature error within 2°C
• Integrated K-type mirror stainless steel inner liner provides excellent insulation, never deforms, and is easy to clean and maintain
• Upper and lower zones heat, circulate and control independently, making the oven suitable for various CHIP components and IC soldering
• Built-in temperature curve test system speeds up profile debugging, and the exit cooling zone with constant-flow forced air cooling protects soldering quality and operator safety

Technical Specifications

SMT Industry News

Industry observers see sustained demand across the SMT equipment market: market research forecasts continued growth of the global chip mounter and SMT equipment market through 2032. At the same time, smart factory and Industry 4.0 integration - MES connectivity, real-time process data and autonomous logistics - is spreading across SMT production lines of all sizes. In this environment, even compact thermal stages matter: a reflow oven with PID closed-loop control, responsive K-type thermocouples and a built-in temperature curve system such as the HW-R306 gives smaller PCB assembly operations the process consistency that connected factories increasingly require.

Applications

The HW-R306 fits the reflow soldering stage of small and medium SMT production lines and PCB assembly workshops, covering LED lighting boards, power supply boards, consumer electronics and mixed CHIP and IC designs. Desktop and vertical frame options suit both bench-top prototyping and compact production layouts, while the exit cooling zone lets operators handle boards safely after soldering. Alongside solder paste printing, pick and place and AOI inspection stages, this hot-air reflow oven from a China SMT machine manufacturer offers a cost-effective path to consistent soldering quality.

Foreign Trade Sales: Mr. Sun
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Email: zghwgc@gmail.com
Website: www.smthw.com
Factory Address: Building 21, Junding Science & Technology Park, Shiyin Village, Luquan District, Shijiazhuang, Hebei, China