HW-A3 Online AOI
The HW-A3 is an inline AOI inspection machine from HWGC, a China SMT machine manufacturer, for pre-reflow and post-reflow inspection on SMT and DIP lines. A 5 MP or 13 MP color camera, an in-house RRGB coaxial LED tower light and a marble platform flat to within 3 μm capture placement and solder defects consistently. The single-rail conveyor takes boards from 50x50 mm to 450x680 mm, and inspection runs at under 230 ms per field of view, backed by SPC data and central server management.
Key Features
- Inline AOI for pre-reflow and post-reflow inspection on SMT and DIP lines
- 5 MP or 13 MP color cameras with resolution from 20 μm/pixel down to 3.45 μm/pixel
- Detects 01005 chips and 0.3 mm pitch ICs, with PCB and FPC warpage compensation
- Marble platform flat within 3 μm and a high-brightness RRGB coaxial LED tower light
- 15 inspection algorithms including OCV, OCR, Histogram, Match, Short, PIN, CREST and PadPlace, auto-set per point
- TCP/IP remote programming and central server management for several AOI machines
- SPC statistics, repeat-defect alarms, 1D/2D barcode recognition and OK/NG output
Technical Specifications
| Product Model | A3 single rail |
| Application | Inline inspection before and after reflow, SMT and DIP lines |
| Algorithms | OCV, OCR, TOC, Histogram, Match, Short, Other, PIN, Length, Hole, CREST, Pole, Offset, Compare, PadPlace; auto-set per point |
| Cameras | 5 MP color camera; 13 MP color camera |
| 5 MP Resolution / FOV / Speed | Standard 20 μm/pixel, FOV 48x40 mm, under 230 ms/FOV; options 25/15/10 μm/pixel (FOV 60x50/36x30/24x20 mm) |
| 13 MP Resolution / FOV / Speed | Standard 15 μm/pixel, FOV 60x45 mm, under 230 ms/FOV; options 10/7/3.45 μm/pixel (FOV 40x30/28x21/13.80x10.35 mm) |
| Light Source | High-brightness RRGB coaxial ring tower LED light source (color) |
| Programming | Manual teach, auto frame drawing, CAD import, component library import; offline/remote programming optional |
| Remote Control | TCP/IP remote operation: view, start or stop the machine, modify programs |
| Solder Paste Printing | Bridging, offset, missing/excess paste, foreign matter |
| Surface Mount | Bridging, wrong/missing part, polarity, offset, tombstone, reverse, damage, bent IC leads, foreign matter |
| After Reflow | Wrong or missing part, polarity, offset, tombstone, reverse, damage, bent IC leads, foreign matter, missing or excess solder, bridging, false solder, solder balls |
| After Wave Solder | Polarity, missing, extra or wrong part, damage, reverse, offset, skew, inserted pins, missing or excess solder, holes, false solder, solder balls |
| Special Functions | Auto program recall, multi-up panel multi-program inspection, front/back program inspection; 0-359 degree rotation (1 degree) |
| Smallest Part | 10 μm; 01005 chip and 0.3 mm pitch IC |
| SPC and Process Control | Full data recording, statistics and analysis; production and quality analysis by area; Excel and TXT export |
| Barcode System | Automatic 1D/2D barcode recognition |
| Server Mode | Central server for several AOI machines |
| Other | Windows 7, 21.5-inch LCD monitor, OK/NG signal |
| PCB Size Range | 50x50 mm (min) to 450x680 mm (max) |
| PCB Thickness Range | 0.3-5 mm |
| Clamping Edge Clearance | Top 3.5 mm, bottom 3.5 mm |
| Maximum PCB Weight | 3 kg |
| PCB Warpage | Under 5 mm or 2% of PCB diagonal |
| PCB Clearance | Top 30 mm, bottom 85 mm |
| Conveyor System | Bottom-up clamping, auto PCB/FPC warpage compensation, auto in/out, flat belt with auto width adjustment |
| Conveyor Height | 890-980 mm |
| Conveyor Direction | Left to right or right to left, settable |
| X/Y Platform Drive | Ball screw and AC servo; PCB fixed, camera moves in X and Y |
| Power Supply | AC 230 V, 50/60 Hz, under 1.5 kW |
| Air Pressure | 0.4-0.8 MPa |
| Machine Weight | Approx. 560 kg |
| Machine Dimensions | Before packing 935x1310x1450 mm; packed 145.0x108.0x165.0 cm; signal light excluded |
| Ambient Temperature | 10-35 °C, 35-80% RH, non-condensing |
| Safety Standard | CE compliant |
SMT Industry News
Automated optical inspection is now a standard station on serious SMT lines. AI server boards and high-end computing PCBs are pushing feature sizes down and board values up, so defects must be caught before expensive assemblies leave the factory. At NEPCON Asia 2026 in October, next-generation placement and packaging systems were shown alongside autonomous material handling and Industry 4.0 tools, and MES connectivity was part of almost every discussion. An inline AOI that images at under 230 ms per FOV and reports through SPC keeps inspection throughput aligned with placement speed.
Applications
The HW-A3 is installed in the SMT line before and after the reflow oven, inspecting solder paste printing, placement and solder joints without extra board handling. It suits high-volume, stable products with few changeovers, such as consumer electronics, power supplies, communications boards and industrial controls, and works on DIP lines before and after wave soldering. Remote programming and central server functions let a small quality team supervise several lines, while barcode recognition and OK/NG signaling support continuous, automated PCB assembly.
Foreign Trade Sales: Mr. Sun
Phone · WhatsApp · WeChat: +86 18210740377
Email: zghwgc@gmail.com
Website: www.smthw.com
Factory Address: Building 21, Junding Science & Technology Park, Shiyin Village, Luquan District, Shijiazhuang, Hebei, China
