HW-A3-3D AOI
The HW-A3-3D is a 3D inline AOI inspection machine from HWGC, a China SMT machine manufacturer. It checks SMT placement quality after mounting and solder joints after reflow, using a 12 MP color high-speed CXP camera, four DLP fringe projection heads and a telecentric lens on an automatic Z axis. The 460x460 mm test table and shadow-free 3D imaging, with a measurement range up to 30 mm, let it inspect tall components and fine solder fillets at a speed of 0.45 s per field of view. AI programming, MES database upload and Industry 4.0 remote control connect the machine to automated PCB assembly lines.
Key Features
- 12 MP color high-speed CXP industrial camera with Adimec sensor technology
- 4DLP fringe module for shadow-free 3D imaging, supported by a small-angle four-projection system that reduces occlusion of fine-pitch parts
- Z-axis automatic lifting telecentric lens with high depth of field and automatic height compensation
- 3D measurement range up to 30 mm and height resolution of ±3 μm for tall components and solder fillets
- 460x460 mm gantry platform handling boards from 0.4 to 6 mm thick and up to 5 kg
- Dual-channel light source: RGB plus low-angle white light, with coaxial illumination
- AI programming, online or offline programming and no-CAD fast programming without Gerber files
- MES database upload, Industry 4.0 remote data management, SPC analysis and no-stop program debugging
- Detects missing parts, offset, bridging, false solder, insufficient or excess solder, missing print, extra parts, reverse placement, flipping, lifted leads and tombstones
Technical Specifications
| Product Model | HW-A3-3D |
| Camera | 12 MP or higher color high-speed CXP industrial camera |
| Camera Brand | Adimec / Eko |
| Number of 3D Projection Heads | 4 |
| Optical Resolution | 10 μm (15 / 7 / 5 μm selectable) |
| Height Resolution | ±3 μm |
| Lens Type | Telecentric lens |
| Table Size | 460x460 mm |
| Platform Type | Gantry structure platform |
| Light Source System | RGB + W four-color light plus coaxial light |
| Light Source Effect | Clear color differentiation of solder at different heights; laser silkscreen text legible; realistic 3D images and sharp 2D images |
| Maximum Component Height | Top side 50 mm, bottom side 50 mm |
| Image Scanning Method | FOV stop-and-go imaging |
| Inspection Principle | DLP programmable digital fringe triangulation algorithm |
| 3D Effect | Industry-leading 3D image display |
| Smallest Detectable Component | 0201 standard, 01005 optional |
| Minimum IC Pin Pitch | 0.25 mm; 0201 standard, 01005 optional |
| Bad Mark Recognition and Auto Shielding | Supported |
| Mark Recognition and Auto A/B Side Program Switching | Supported |
| Inspection Speed | 0.45 s/FOV |
| Programming Method | Online or offline programming |
| Offline Programming | Standard |
| Automatic Z Axis | Standard |
| Area Coaxial Light | Standard |
| Red Glue Board Process (Tinned Board) | Supported |
| No-Stop Debugging | Supported |
| Height Accuracy | 1 μm within 20 mm |
| Program Sharing | Programs shared between same-series equipment |
| X and Y Axis Motors | Panasonic |
| Ball Screw | THK |
| Motion Control Card | Googol |
| Computer Configuration | AMD 5950X (32 threads), 128 GB RAM, 1 TB SSD + 6 TB HDD dual drives, GeForce RTX 3060 graphics |
| Hardware Bypass | Standard |
| Maximum Board Size | 460x460 mm |
| Maximum Board Weight | 5 kg |
| Board Thickness | 0.4-6 mm |
| 2D Code Inspection | Supported |
SMT Industry News
AI server boards and high-end computing PCBs are driving strong demand for SMT capacity, and market research forecasts continued growth of the global chip mounter and SMT equipment market through 2032. Higher layer counts, finer pitches and expensive components make escape defects far costlier than in the past, so inspection has to keep pace with placement rather than lag behind it. A 3D AOI machine that images shadow-free at 0.45 s per FOV, and that shares programs across same-series equipment, helps factories raise quality without turning the inspection station into a bottleneck. MES upload and Industry 4.0 connectivity also feed the process data that smart factory teams now expect from every station.
Applications
The HW-A3-3D is placed after the placement machines and after the reflow oven in SMT production lines, inspecting both placement quality and solder joints without slowing the line. It suits electronics manufacturers producing automotive electronics, communications equipment, power supplies, industrial control boards and other PCB assemblies with fine-pitch components and tall parts. Contract manufacturers use it for high-mix production, because AI programming and no-CAD programming reduce changeover time, while quality teams rely on its SPC reports and defect images to adjust the printing and placement processes. It is an automated optical inspection solution for factories that need reliable 3D AOI inspection.
Foreign Trade Sales: Mr. Sun
Phone · WhatsApp · WeChat: +86 18210740377
Email: zghwgc@gmail.com
Website: www.smthw.com
Factory Address: Building 21, Junding Science & Technology Park, Shiyin Village, Luquan District, Shijiazhuang, Hebei, China
