SMT Cleaning Techniques
Article Outline : Symptom-Based Solutions : Error Code E507 : Feeder misalignment – recalibrate with go/no-go gauge. Inconsistent Paste : Check solder viscosity (150–200 Pa·s). Z-Axis Drift : Replace linear encoder scales. Quick-Reference Table : Common issues, tools needed,...
Product Introduction
Post-reflow cleaning removes flux residues and contaminants. Solvent-based, aqueous, or semi-aqueous methods are chosen based on paste type. No-clean pastes may skip cleaning but require validation for high-reliability applications. Ionic contamination testing (e.g., ROSE test) ensures compliance with IPC-6012. Microvoids under BGAs demand specialized underfill cleaning. Automated batch or inline cleaners use spray jets and DI water rinsing. Eco-friendly bio-solvents reduce environmental impact. Challenges include component shadowing and fine-pitch residue removal. Ultrasonic cleaning risks damaging fragile components. Cleaning process validation aligns with ISO 14644-1 cleanliness standards.
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