HW-R406 Reflow Oven

The HW-R406 is a four-zone rail-type SMT reflow oven supplied by a China SMT machine manufacturer. Hot air melts the solder paste on PCB pads, forming dependable solder joints for surface mount components. Headline specifications include upper 4 / lower 2 heating zones over a 1320 mm heating length, a 300 mm mesh belt width with a 230 mm rail, temperature control precision of ±1°C, and PCB lateral temperature deviation of ±2°C. With vacuum-sealed nickel-chromium heating elements, K-type thermocouples and touch-screen PID closed-loop control, it delivers repeatable thermal profiles for mid-volume SMT production lines and PCB assembly.

Key Features

• Vacuum-sealed nickel-chromium heating elements with double magnesium-oxide insulation keep air away from the heating wire, preventing oxidation for ultra-long heater life
• K-type thermocouples rated up to 1100°C use exposed probes that respond within 2 seconds, keeping the difference between set temperature and actual board-level air temperature within 1°C
• Turbo-charged hot-air micro-circulation with air guide and accelerator design prevents backflow, cutting heat loss and raising thermal efficiency
• Motor-driven aluminum wind wheel improves chamber heat circulation and thermal compensation for better uniformity while saving power
• Warm-up from room temperature to constant temperature takes about 8 minutes; one-key start allows production about 15 minutes after power-on for standard processes, with hourly power consumption of no more than 3 kWh
• Touch-screen PID closed-loop control keeps PCB surface lateral air temperature error within 2°C
• Rail-type transport: 230 mm rail with stainless steel Z-shaped mesh belt and 0-1200 mm/min electronic speed control for in-line production
• Upper 4 / lower 2 zones with independent heating, circulation and control suit various CHIP components and IC soldering
• Built-in temperature curve test system speeds up profile debugging, and the exit cooling zone with constant-flow forced air cooling protects solder joint quality and operators

Technical Specifications

SMT Industry News

At NEPCON Asia 2026 in October, exhibitors presented next-generation SMT placement systems, advanced packaging solutions and autonomous material handling, including the China debut of the ASMPT SIPLACE V, Essemtec all-in-one SMT and packaging solutions, and Hanwha Semitec chip mounters with AMR robots. Alongside these flagship systems, market research forecasts continued growth of the global chip mounter and SMT equipment market through 2032. For mid-volume manufacturers, that growth agenda is built on dependable mid-line equipment: a four-zone rail reflow oven like the HW-R406 keeps thermal profiles tight and repeatable between the printing, placement and inspection stages of the SMT production line.

Applications

The HW-R406 four-zone rail reflow oven suits mid-volume SMT production lines and PCB assembly workshops producing LED lighting, power supplies, consumer electronics and control boards. Rail plus mesh belt transport lets it integrate directly between solder paste printing and the pick and place stage, then hand boards to AOI inspection after soldering. With 0-1200 mm/min electronic conveyor speed control, a 230 mm rail width and ±1°C temperature control precision, it offers dependable in-line reflow soldering for factories building or upgrading an SMT production line with a China SMT machine manufacturer.

Foreign Trade Sales: Mr. Sun
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