Moisture Sensitive Handling

MSL (Moisture Sensitivity Level) compliance prevents "popcorning" damage. IPC/JEDEC J-STD-033 defines bake-out protocols: Level 3 components require 168hr floor life at <30% RH. Dry cabinets maintain <5% humidity with nitrogen purge. Baking profiles: 125°C for 24hrs for moisture removal. Component packaging includes humidity indicator cards and moisture-barrier bags. Failure analysis detects delamination via scanning acoustic microscopy. High-reliability medical devices mandate Level 1 handling.