Avoiding Common Mounter Defects
May 06, 2025
Content:
Top defects and solutions:
Tombstoning: Fix by reducing pad size asymmetry (1:0.8 ratio for 0402 resistors).
Solder balling: Store paste at <30% humidity and pre-bake PCBs at 120°C for 2 hours.
Component cracking: Use low-force (<1N) nozzles for fragile MEMS sensors.
Juki's RX-7 series reduced tombstoning by 50% with adaptive pressure control.
Tool Recommendation:
X-ray inspection for BGA void analysis (target <5% void area).
