Vapor Phase Soldering

Uniform heating via fluorocarbon vapor condensation. Temperature accuracy: ±1°C across PCB. Benefits: Zero oxidation, ideal for high-density boards. Process: Preheat (80°C), vapor phase (215°C), cooling. Energy consumption 40% lower than convection. Modern fluids: Galden® HT270 with zero ODP. Applications: Power electronics and LED modules.