Flexible PCB Assembly

Polyimide-based flex circuits demand specialized SMT processes. Low-temperature solders (Sn42Bi58, melting point 138°C) prevent substrate damage. Adhesive bonding supplements solder for high-stress areas. Placement accuracy requires vision systems compensating for flex movement. Dynamic flex testing (IPC-6013D) validates 100,000+ bend cycles. Challenges: CTE mismatch mitigation using anisotropic conductive films. Applications: Wearable sensors and foldable displays. Laser ablation enables circuit patterning with 20μm tolerance.